Lead Package Design Engineer

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LEAD PACKAGE DESIGN ENGINEER

The Role

The ideal candidate of this role will be the technical lead in Xilinx package design and development department to oversee package definition, design, verification, and documentation. The responsibilities of this role will include but not limited to:

• Determine package architecture and design, assess package performance and cost tradeoff, collaborate with cross-functional team for package technology and design rule development and drive package structure planning to form working POR
• Drive package integration efforts to meet advanced FPGA package design requirements including silicon/TSV and RDL package development, package stack-up/routing/PDN feasibility study, and discrete decoupling assessment and system board interfaces planning
• Drive cost reduction through the adoption of leading-edge package technology while achieving performance-driven objectives
  
  

Key Responsibilities

• Possess good understanding of high-speed serdes, memory interface, supply voltage noise, and packaging technologies/trends to drive package design validation throughout all phases of the product cycle
• Familiar with system stack, package layout, component thermal and mechanical, material, component/system level reliability, testing, and failure analysis
• Understand in-depth package development flow and work closely with NPI program management and manufacturing/process team to synthesize a cohesive package introduction plan. Interface and negotiate effectively across engineering teams to balance performance adequacy and schedule commitment. Drive continuous improvement in package design and development cycle and ensure robust package design to meet performance, quality, cost and capacity requirements
• Drive package design review, manage modeling/simulation projects, prepare and present the final design review (FDR) to all product partners
• Identify package technology gap against new product requirements and collaborate with cross-functional groups to enable new package technology and facilitate package design gap closure
• Familiar with package design rules, physical layout and tools used for package design and DRC. Recommend and enable new flow and tool features for package design evolving from new package technology
  
  

Preferred Experience

• Industry experience in IC package technology and product development in the semiconductor industry with consistent track record.
• 5+ years project/program execution and management experience in the IC package development field.
  
  

Demonstrate technical leadership in complex product development under challenging technical and schedule conditions

Academic Credentials

BS with 18+ years or MS with 15+ years in Electrical Engineering, Computer Engineering, Mechanical Engineering, Material Science or Physics and relevant experience within technical discipline.

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.